IBS SUPI 3 OPC
Product ID:17086
Updated: 2026/4/3
Key Features
- 1Advanced INTERBUS Communication: Supports remote bus, local bus, and remote fiber optic bus connections.
- 2Compact Design: TQFP 64 package with copper block, measuring 14 mm x 1.2 mm x 14 mm.
- 3High Reliability: Operates within -40°C to 85°C ambient temperature range with up to 75% humidity.
- 4Versatile Interfaces: Includes MFP interface, digital I/O (2-8 IN/OUT, 16 IN/16OUT), SPI master interface, and serial microprocessor interface.
- 5Efficient Power Consumption: Typical current consumption of 40 mA without analog control at 5 V DC ±10% power supply voltage.
Technical Specifications
Detailed engineering parameters
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Note on application | Only for industrial use | Product type | Protocol chip |
| Type | TQFP 64 (with copper block) | Internal data length | 4 bytes internally, external expansion is possible up to 64 bytes |
| IC power supply voltage | 5 V DC ±10 % (DC) | Typical current consumption | 40 mA (without analog control) |
| User interface | MFP interface, digital I/O (2-8 IN/OUT, 16 IN/16OUT), SPI master interface (direct serial coupling to ADC/DACs) and serial microprocessor interface | Connection method | Remote bus/local bus or remote fiber optic bus |
| Width | 14 mm | Height | 1.2 mm |
| Depth | 14 mm | Length | 14 mm |
| Degree of protection | IP00 | Ambient temperature (operation) | -40 °C ... 85 °C (at max. 75 % humidity during operation) |
| Ambient temperature (storage/transport) | 5 °C ... 30 °C (at max. 60 %) |
Specifications may be subject to change without notice