140XBP00600C
Product ID:29837
Updated: 2026/4/3
Key Features
- 1Connect up to six I/O modules for flexible system expansion. 2、Ensure reliable data transfer in demanding industrial environments. 3、Simplify installation with straightforward mounting on a support plate. 4、Reduce maintenance costs with durable, high-quality construction. 5、Receive peace of mind with a comprehensive 2-year warranty.
Technical Specifications
Detailed engineering parameters
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Range of Product | Modicon Quantum automation platform | Product or Component Type | Rack backplane |
| Product Specific Application | For local I/O modules<br />For distributed I/O modules<br />For remote I/O modules | Free slots | 6 |
| Mounting Support | Mounting plate | Fixing Mode | By screw |
| Net Weight | 1.41 lb(US) (0.64 kg) | Protective treatment | Conformal coating Humiseal 1A33 |
Specifications may be subject to change without notice