140XBP00600C

Product ID:29837
Updated: 2026/7/15
schneider 140XBP00600C

Key Features

  • 1Connect up to six I/O modules for flexible system expansion.
  • 2Ensure reliable data transfer in demanding industrial environments.
  • 3Simplify installation with straightforward mounting on a support plate.
  • 4Reduce maintenance costs with durable, high-quality construction.
  • 5Receive peace of mind with a comprehensive 2-year warranty.

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Technical Specifications

Detailed engineering parameters

ParameterValueParameterValue
Range of Product
Modicon Quantum automation platform
Product or Component Type
Rack backplane
Product Specific Application
For local I/O modules<br />For distributed I/O modules<br />For remote I/O modules
Free slots
6
Mounting Support
Mounting plate
Fixing Mode
By screw
Net Weight
1.41 lb(US) (0.64 kg)
Protective treatment
Conformal coating Humiseal 1A33

Specifications may be subject to change without notice

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