TSXFPACC3

Product ID:34430
Updated: 2026/7/15
schneider TSXFPACC3

Key Features

  • 1Connect multiple Fipio modules within Modicon systems using an insulated bus.
  • 2Save valuable space in control cabinets with a compact design.
  • 3Provide physical connection and electrical isolation between Fipio modules.
  • 4Ensure reliable signal transmission with built-in electrical insulation.
  • 5Use for analog/digital I/O expansion and specialized function modules.

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Technical Specifications

Detailed engineering parameters

ParameterValueParameterValue
Range of Product
Modicon Premium Automation platform
Accessory / separate part designation
Insulated bus connection box
accessory / separate part type
Connection box
accessory / separate part category
Connection accessories
Product Specific Application
For trunk cable tap link<br />For connecting 24 V power supply of dust and damp proof TBX modules
Electrical connection
1 connector SUB-D 9
Enclosure Material
Polycarbonate
Net Weight
0.20 lb(US) (0.09 kg)
IP Degree of Protection
IP20

Specifications may be subject to change without notice

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